INEX Chipset Gap Fill Heat Transfer Putty HP-01
Product details
| Management number | 237043503 | Release Date | 2026/07/10 | List Price | US$7.75 | Model Number | 237043503 | ||
|---|---|---|---|---|---|---|---|---|---|
| Category | |||||||||
■ Clay heat transfer putty. ■ Can be used between the chipset such as CPU, GPU, M.2 SSD, memory chip, etc. ■ The shape can be adjusted, so it is suitable for filling rough surfaces. ■Can be used with chipsets such as expansion cards, memory, motherboards, etc. ■ Since the shape is free-up, it is also compatible with M.2 SSDs of sizes such as 2230/2242/2260. ■ Can be freely shaped, so it can be used for a variety of purposes. ■Insulation/flame retardant properties. ■ Non-sticky, so it will not damage the surface of the item you want to cool. Note: There is no adhesive force, so please use the heatsink in an environment where it is fixed with pins, screws, or tape.
- Clay heat transfer putty. Suitable for filling rough surfaces
- Thermal conductivity: 6.0W/m / K
- Heat Resistance: 0.025 °C, in2/W, Operating Temperature: -4 to 330 °F (-20 to 150 °C)
- Insulation Breaking Voltage: >2.5kV/mm, Specific Gravity: 3.2g/cm3
- Color: Gray; Quantity: 5g; RoHS compliant (10 substances)
| ASIN | B0DLGS5GY7 |
|---|---|
| Model | HP-01 |
| Brand Name | AINEX |
| Unit Count | 1.0 Count |
| Item Weight | 8.9 Grams |
| Part Number | HP-01 |
| Manufacturer | AINEX |
| Mounting Type | PCBマウント |
| Cooler Heatsink Material | Clay |
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