Cooler Master Thermal Pad - 13.3W/mK Thermal Conductivity, Improves PC Component Cooling, Electrically Non-Conductive, Double-Sided Adhesive & Easy to Apply - 95 x 45 x 0.5mm

The Cooler Master Thermal Pad is an innovative and efficient thermal compound that provides superior thermal conductivity with none of the mess associated with thermal pastes. Formulated with nano zinc oxide and nano alumina, the Thermal Pad boasts a high thermal conductivity of 13.3W/mK for rapid cooling. Non-toxic, non-corrosive, and electrically insulated properties make it a safe and simple solution for device cooling by eliminating the worry of hardening, solidifying or short circuiting. Double-sided adhesive provides seamless contact between surfaces, and the pad can be cut to any size, making it compatible with a multitude of devices, such as motherboards, CPUs, GPUs, and much more.

• SUPERIOR THERMAL CONDUCTIVITY - The Cooler Master Thermal Pad features nanoparticles (zinc oxide & alumina) for premium thermal conductivity (13.3 W/mK) to help rapidly cool PC components
• NON-TOXIC, NON-CORROSIVE & ELECTRICALLY INSULATED - The pads are safe to handle, heat resistant, and are non-corrosive to metal components; There is no risk of electrical transmission through the pads as they are electrically non-conductive
• SECURE DOUBLE-SIDED ADHESIVE - The Thermal Pad employs a double-sided adhesive in order to provide secure and seamless contact between the surfaces of targeted components
• EASY APPLICATION - The Cooler Master Thermal Pad can be easily cut and tailored to the perfect size for a simple & clean application
• EXCELLENT COMPATIBILITY - The Thermal Pad can be applied on a wide range of components, such as motherboards, CPUs, GPUs, USICS, hard drives, disk drives, IGBT modules, laptops, and other electronics to improve performance